EP2C8F256I8N vs EP2C8F256I8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C8F256I8N disebabkan oleh Intel dan EP2C8F256I8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2C8F256I8N | EP2C8F256I8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | — |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | [DATA_NEEDED: VCCINT voltage] |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | — |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Suhu Operasi | -40C to +85C (industrial) | — |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Status RoHS | Compliant (Pb-free, lead-free reflow compatible) | Unknown - no N suffix; verify in distributor data |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Logic Elements | — | 8,256 |
| Number of User I/O | — | 182 |
| Number of LABs / CLBs | — | 516 |
| Kemasan | — | 256-LBGA (FBGA-256) |
| Number of Terminals / Balls | — | 256 |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial (suffix 'I') |
| Speed Grade | — | 8 (per suffix) |
| I/O Standard Support | — | [DATA_NEEDED: Supported I/O standards] |
| Number of PLLs | — | [DATA_NEEDED: Number of PLLs] |
| Configuration Methods | — | [DATA_NEEDED: AS / PS / JTAG support details] |