EP2SGX130GF40C3NES vs EP2SGX130GF1508C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX130GF40C3NES disebabkan oleh Altera dan EP2SGX130GF1508C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Altera
EP2SGX130GF40C3NES - Stratix II GX FPGA, 132K LE, 6.375Gbps | Altera
EP2SGX130GF40C3NES ObsoleteIntel
EP2SGX130GF1508C3N - Stratix II GX FPGA, 132K LEs, 20x Transceivers | Intel
EP2SGX130GF1508C3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX130GF40C3NES | EP2SGX130GF1508C3N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Family | Stratix II GX | FPGA - Field Programmable Gate Array |
| Logic Elements | 132540 | 132,540 |
| Logic Array Blocks (LABs) | 7047 | 6,627 |
| Maximum Internal Frequency | 778.82 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Transceiver Channels | 4 to 20 (per device family configuration) | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Feature | Embedded SERDES with Clock/Data Recovery (CRU) | — |
| Jenis Ingatan | TriMatrix embedded memory (distributed RAM, block RAM, shift register) | — |
| Kemasan | 1508-ball FC-FBGA (40 x 40 mm, 1 mm pitch) | 1508-ball FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch |
| Operating Temperature Grade | Commercial Extended | — |
| Terminal Form | Ball (BGA) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Lead-free compliant (per package code MS-034AAU-1) | Lead-free / RoHS Compliant |
| Series | EP2SGX130 | Stratix II GX |
| User I/Os | — | 734 |
| Total RAM Bits | — | 6,747,840 (approximately 6.75 Mbit) |
| Number of Transceivers | — | 20 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Number of 18x18 Multipliers | — | 56 |
| Number of PLLs | — | 12 |
| Internal Fabric Clock (max) | — | 717 MHz |
| Memory Clock (max) | — | 717 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature Range (TJ) | — | 0 °C to 85 °C (commercial) |
| Estimated EOL Date | — | 2023 (per GlobalSpec listing) |