EP2SGX30DF780I4 vs EP2SGX30DF780I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30DF780I4 disebabkan oleh Intel dan EP2SGX30DF780I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
EP2SGX30DF780I4 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2SGX30DF780I4 | EP2SGX30DF780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements / Cells | 33,880 | — |
| Total RAM Bits | 1,369,728 | — |
| Number of LABs | 1,694 | — |
| User I/O Count | 361 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Nominal Supply Voltage (Core) | 1.2 V | — |
| Internal Operating Frequency | 622 MHz | — |
| Frekuensi Klock Maksimum | 717 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Suhu Operasi | -40C to +85C (Industrial) | — |
| Kemasan | 780-ball FC-FBGA, 29x29 mm, 1 mm pitch | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch |
| Jenis Pemasangan | Surface Mount (Flip-chip BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Number of Transceivers | [DATA_NEEDED: number of transceiver channels] | — |
| Number of PLLs / DLLs | [DATA_NEEDED: number of PLLs] | — |
| Logic Elements | — | 33,880 |
| Logic Cells | — | 33,380 |
| Configurable Logic Blocks (CLBs) | — | 33,880 |
| Total Memory Bits | — | 1,369,728 |
| Maximum Core Frequency | — | 622.08 MHz |
| Core Supply Voltage | — | 1.2 V |
| User I/O Pins | — | 361 |
| Operating Temperature Grade | — | Industrial |
| Lead Free | — | Yes |
| Speed Grade | — | I3 |