EP2SGX30DF780I4N vs EP2SGX30CF780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30DF780I4N disebabkan oleh Intel dan EP2SGX30CF780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX30DF780I4N - 33,880 Logic Cells Stratix II GX FPGA | Intel
EP2SGX30DF780I4N ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2SGX30DF780I4N | EP2SGX30CF780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | 33,880 |
| Logic Blocks (CLBs) | 33,880 | — |
| Number of User I/O | 361 | — |
| Number of Inputs | 361 | — |
| Bilangan Output | 361 | — |
| Total RAM Bits | 1,369,728 bits | — |
| Internal Clock Frequency | 622 MHz | — |
| Frekuensi Klock Maksimum | 717 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | — |
| Suhu Operasi | -40C to +85C (Industrial) | 0C to +85C (commercial) |
| Kemasan | 780-pin FBGA (29 mm x 29 mm, 1 mm pitch) | 780-ball FineLine BGA |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Speed Grade | I4 (Industrial, Speed Grade 4) | -3 |
| Lead Free | Yes | — |
| Status RoHS | Compliant | Compliant |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Transceivers | — | Embedded (GX family, up to 3.125 Gbps per channel) |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Lead-Free | — | Yes |
| Boson Bebas | — | [DATA_NEEDED: halogen-free status] |