EP2SGX60CF780C3 vs EP2SGX60CF780C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60CF780C3 disebabkan oleh Intel dan EP2SGX60CF780C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
EP2SGX60CF780C5N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60CF780C3 | EP2SGX60CF780C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix II GX | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 60,440 | 60,440 (60K LE) |
| Logic Array Blocks (LABs) | 3,022 | 3022 |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | 364 |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm CMOS |
| Speed Grade | C3 (commercial) | — |
| Kemasan | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | 780-BBGA, FCBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Suhu Operasi | Commercial (0C to +85C junction) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Series | — | Stratix II GX |
| Total RAM Bits | — | 2,544,192 (approximately 2.5 Mbit) |
| High-Speed Transceiver Channels | — | 20 (up to 6.375 Gbps per channel) |
| Internal Frequency (max) | — | 717 MHz |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive/active serial |
| Operating Temperature Grade | — | Commercial (C) |
| Transceiver Data Rate | — | Up to 6.375 Gbps |