EP2SGX60CF780C3 vs EP2SGX60DF780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60CF780C3 disebabkan oleh Intel dan EP2SGX60DF780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX60CF780C3 | EP2SGX60DF780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm |
| Speed Grade | C3 (commercial) | C3 (fastest commercial) |
| Kemasan | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Suhu Operasi | Commercial (0C to +85C junction) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 60,440 |
| Total RAM Bits | — | [DATA_NEEDED: total embedded memory bits] |
| Number of I/O | — | 364 |
| Number of Transceivers | — | Up to 20 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Internal Frequency (max) | — | ~717 MHz |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |