EP2SGX60EF1152C5N vs EP2SGX60EF1152C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152C5N disebabkan oleh Intel dan EP2SGX60EF1152C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Bahagian terakhir untuk beliIntel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60EF1152C5N | EP2SGX60EF1152C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Stratix II GX | — |
| Logic Elements (LE) | 60,440 | — |
| Logic Array Blocks (LABs) | 3022 | — |
| Embedded Memory Bits | 2,544,192 | — |
| User I/O Count | 534 | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Maximum Operating Frequency | 609.76 MHz | — |
| Kemasan | 1152-ball FC-FBGA | 1152-ball FC-FBGA (35 x 35 mm) |
| Speed Grade | -5 (mid) | — |
| Suhu Operasi | Commercial (0C to +85C) | 0C to +85C (Commercial, C3 suffix) |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| LABs / CLBs | — | 3,022 |
| User I/Os | — | 534 |
| Total Memory Bits | — | 2,544,192 |
| Number of Transceivers | — | 36 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Multipliers (18x18) | — | 252 |
| Configuration Memory Interface | — | EPCS serial configuration devices |