EP2SGX90EF1152I3 vs EP2SGX90EF1152C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152I3 disebabkan oleh Intel dan EP2SGX90EF1152C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX90EF1152I3 | EP2SGX90EF1152C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 90,960 |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | FPGA - Field Programmable Gate Array |
| Logic Array Blocks (LABs) | — | 4,548 |
| User I/Os | — | 558 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage | — | 1.2 V |
| Kemasan | — | 1152-ball FC-FBGA |
| Speed Grade | — | 5 |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 12 multi-gigabit transceivers |
| Transceiver Data Rate | — | Up to 6.375 Gbps |