EP3C10F256C6 vs EP3C10F256C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C10F256C6 disebabkan oleh Intel dan EP3C10F256C8N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C10F256C6 | EP3C10F256C8N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | — |
| Logic Elements (LE) | 10,320 | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | — |
| Kemasan | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-pin FineLine BGA (FBGA-256, 17 x 17 x 1.8 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS |
| Configuration Memory | SRAM-based (external EPCS flash required) | — |
| Suhu Operasi | -40 C to +125 C (industrial, suffix 'C') | 0 C to 85 C (Commercial, 'C' grade) |
| Speed Grade | 6 | — |
| Status RoHS | Compliant (lead-free FBGA) | Compliant |
| Aras MSL | 3 (168 hours) | MSL3 (per JEDEC J-STD-020, typical for FineLine BGA) |
| Series | — | Cyclone III |
| Logic Elements | — | 10,320 |
| Logic Array Blocks (LABs) | — | 645 |
| Embedded Memory (Bits) | — | 423,936 |
| User I/Os | — | 182 |
| Operating Frequency (max) | — | 402 MHz |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (1.2 V nominal) |
| Lead-Free | — | Yes |
| Configuration Method | — | SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG |
| Equivalent Gate Count | — | ~0.5 M Gates (approximate) |