EP3C40F780C8 vs EP3C55F780C8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C40F780C8 disebabkan oleh Intel dan EP3C55F780C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C40F780C8 | EP3C55F780C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Series | EP3C40 | — |
| Logic Elements | 39,600 | 55,856 |
| Total Memory Bits | 1,161,216 bits (1134 Kbit) | — |
| Embedded Memory | M9K blocks, 486 Kbit total (per family datasheet) | 2,396,160 bits (234 M9K blocks) |
| Embedded 18x18 Multipliers | 126 | — |
| General Purpose PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Maximum User I/O Pins | 535 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Kemasan | 780-ball FBGA (FineLine BGA) | 780-ball FBGA |
| Speed Grade | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) | 8 |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Supported Memory Interfaces | DDR, DDR2, QDRII SRAM (via dedicated PHY) | — |
| Configuration | Serial (AS) / Parallel (AP) / JTAG | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Embedded Multipliers (18x18) | — | 156 |
| User I/O Pins | — | 377 |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| Configuration Memory | — | SRAM-based |