EP3C5F256C6 vs EP3C5F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256C6 disebabkan oleh Intel dan EP3C5F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256C6 | EP3C5F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | 423,936 bits |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | — |
| User I/Os | 182 | — |
| PLLs | 4 | 2 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 65 nm CMOS, low-k | TSMC 65nm low-power |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Kemasan | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-FBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | Active Serial, Passive Serial, JTAG, FPP |
| Status RoHS | Compliant (lead-free per FBGA package) | Compliant |
| Logic Elements | — | 5,136 |
| Embedded Multipliers (18x18) | — | 26 |
| Maximum User I/Os | — | 182 |
| Suhu Operasi | — | -40C to +125C (Industrial) |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (typical 1.2 V) |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Aras MSL | — | 3 (168 hours) |