EP3CLS200F484C8N vs EP3CLS200F484I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS200F484C8N disebabkan oleh Intel dan EP3CLS200F484I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS200F484C8N | EP3CLS200F484I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III LS | — |
| Family | Cyclone® III LS | — |
| Logic Elements | 198,464 | — |
| Embedded Memory | 8,211,456 bits (8.21 Mbit) | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: exact LAB count] | — |
| Embedded Multipliers (18x18) | 396 | — |
| User I/O Pins | 210 | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm CMOS, low-leakage | 65 nm |
| Maximum Operating Frequency | 402 MHz (fabric) | 437.5 MHz |
| Kemasan | 484-ball FBGA (FineLine BGA), 23 x 23 mm | — |
| Speed Grade | 8 (slowest) | 7 |
| Temperature Grade | Commercial (0C to +85C TJ) | — |
| Bitstream Encryption | AES-128 (256-bit key via separate license) | — |
| Configuration Mode | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Device Family | — | Cyclone III LS |
| Logic Elements (LEs) | — | 198,464 |
| Embedded Memory Bits | — | 8,211,456 |
| Maximum User I/O | — | 210 |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | FBGA-484 |
| Pin/Ball Count | — | 484 |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Configuration Scheme | — | FPGA (SRAM-based, external configuration) |
| Hardware Crypto Accelerator | — | Yes (AES, SHA - LS family feature) |