EP3SE110F1152I2N vs EP3SE110F1152I4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152I2N disebabkan oleh Intel dan EP3SE110F1152I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE110F1152I2N | EP3SE110F1152I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Stratix III Enhanced (EP3SE110) | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) / CLBs | 4,300 | — |
| System Gates | 8,936,448 | — |
| User I/O Pins | 744 | — |
| Number of Terminals | 1,152 | — |
| Package Code | BGA (FCBGA) | — |
| Package Shape | Square | — |
| Ball Pitch | 1.00 mm | — |
| Supply Voltage Range | 1.05 V to 1.15 V (nominal 1.1 V) | — |
| Process Technology | 40 nm low-power CMOS | 40 nm |
| Maximum Internal Clock Frequency | 100 MHz (per distributor summary; device supports multi-Gbps transceivers) | — |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | I2 | I4 (fastest industrial grade) |
| Lead-Free / RoHS | Yes (suffix N) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Logic Elements | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 bits |
| User I/O Count | — | 744 |
| Number of LABs/CLBs | — | 4300 |
| DSP Multipliers | — | 528 (9-bit equivalent) |
| Kemasan | — | 1152-BBGA, FCBGA |
| Supply Voltage (Core) | — | [DATA_NEEDED: nominal core voltage] |
| Aras MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance status] |