EP3SE110F1152I3 vs EP3SE110F1152C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152I3 disebabkan oleh Intel dan EP3SE110F1152C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE110F1152I3 - Stratix III E FPGA 107.5K LE 1152-FBGA | Intel
EP3SE110F1152I3 ⚠ Bahagian terakhir untuk beliIntel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE110F1152I3 | EP3SE110F1152C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Series | Stratix III E | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 107,500 | — |
| Total Memory Bits | 8,936,448 | — |
| LABs/CLBs | 4,300 | — |
| Number of I/O | 744 | — |
| Number of Logic Elements/Cells | 107,500 | — |
| Total RAM Bits | 8,936,448 | — |
| Core Operating Frequency | 500 MHz | — |
| Tegangan Pemberi Arus | 1.1 V | — |
| Process Technology | 65 nm CMOS (1.1 V, all-layer copper SRAM) | 65 nm |
| Package Type | 1152-BBGA, FCBGA (FC-FBGA) | 1152-ball FCBGA (Flip-Chip BGA) |
| Jenis Pemasangan | Surface Mount | — |
| Suhu Operasi | -40C to +100C (Industrial, I3 grade) | — |
| Status RoHS | Non-Compliant per DigiKey product page | Compliant |
| Family | — | Stratix III E |
| Logic Elements | — | 107,500 |
| Embedded Memory | — | 8,936,448 bits |
| Maximum User I/Os | — | 744 |
| DSP Blocks | — | [DATA_NEEDED: 18x18 multiplier count] |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Core Voltage | — | 1.1 V |
| Maximum Performance | — | 450 MHz |
| Operating Temperature Grade | — | Commercial (C4) |
| Configuration Memory | — | SRAM-based (volatile) |
| On-chip Termination | — | Dynamic, programmable |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |