EP3SE260F1152C3NES vs EP3SE260F1152C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C3NES disebabkan oleh Altera dan EP3SE260F1152C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Altera
EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera
EP3SE260F1152C3NES ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP3SE260F1152C3NES | EP3SE260F1152C2 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Manufacturer | Altera (now Intel FPGA) | Intel (formerly Altera) |
| Series | Stratix III E | Stratix® III E |
| Family | Stratix III Enhanced | — |
| Logic Elements (LE) | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Number of I/Os | 744 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Supply Voltage | 1.1 V | — |
| Number of 18x18 Multipliers | 768 | — |
| Number of PLLs | 12 | — |
| Package Type | 1152-ball FBGA (FineLine BGA) | — |
| Pin/Package Designator | F1152 | — |
| Speed Grade | -3 (faster) | C2 (commercial) |
| Hard Memory Controllers | 4 | — |
| Hard PCIe Blocks | 4 | — |
| External Memory Interface | DDR3, DDR2, DDR, QDRII+, RLDRAM2 | — |
| Operating Temperature Grade | Commercial | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Kemasan | — | 1152-ball FC-FBGA (Flip Chip) |
| Suhu Operasi | — | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |