EP3SE260F1517C2 vs EP3SE260F1517C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C2 disebabkan oleh Altera dan EP3SE260F1517C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Altera
EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
EP3SE260F1517C2 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517C2 | EP3SE260F1517C3 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Series | Stratix® III E | Stratix III E |
| Logic Elements (LE) | 254,400 | — |
| Logic Array Blocks (LAB) | 10,200 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Total Memory Bits | 16,672,768 | — |
| Distributed RAM (Kb) | 4,608 | — |
| Embedded Block RAM (Kb) | 15,408 | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/O Pins | 976 | — |
| High-Speed Transceivers | 48 (up to 6.375 Gbps) | — |
| PLLs | 12 | 12 |
| Speed Grade | C2 | 3 |
| Temperature Grade | Commercial (0C to +85C, suffix C2) | — |
| Kemasan | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Process Node | TSMC 40 nm | 65 nm (TSMC) |
| Status RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 multipliers) | — | 768 |
| Core Voltage | — | 0.9 V |
| Package Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Configuration | — | SRAM-based, requires external configuration device |