EP3SE260F1517C2 vs EP3SE260F1517C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C2 sa pamamagitan ng Altera at EP3SE260F1517C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
EP3SE260F1517C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1517C2 | EP3SE260F1517C3 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Series | Stratix® III E | Stratix III E |
| Logic Elements (LE) | 254,400 | — |
| Logic Array Blocks (LAB) | 10,200 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Total Memory Bits | 16,672,768 | — |
| Distributed RAM (Kb) | 4,608 | — |
| Embedded Block RAM (Kb) | 15,408 | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/O Pins | 976 | — |
| High-Speed Transceivers | 48 (up to 6.375 Gbps) | — |
| PLLs | 12 | 12 |
| Speed Grade | C2 | 3 |
| Temperature Grade | Commercial (0C to +85C, suffix C2) | — |
| Packhaging | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Process Node | TSMC 40 nm | 65 nm (TSMC) |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 multipliers) | — | 768 |
| Core Voltage | — | 0.9 V |
| Package Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Configuration | — | SRAM-based, requires external configuration device |