EP3SE260F1517C3 vs EP3SE260F1517I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C3 disebabkan oleh Intel dan EP3SE260F1517I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1517C3 | EP3SE260F1517I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 1.0 V typical |
| Process Node | 65 nm (TSMC) | — |
| Kemasan | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | Industrial |
| Speed Grade | 3 | — |
| Configuration | SRAM-based, requires external configuration device | SRAM-based, volatile (requires external configuration device) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | Stratix III E |
| Embedded Memory (bits) | — | 16,672,768 |
| Maximum User I/Os | — | 976 |
| Junction Temperature Range | — | -40C to +125C |
| Process Technology | — | 65 nm CMOS |
| Maximum Core Frequency | — | 717 MHz |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |