EP3SE260H780I4L vs EP3SE260H780C4LN Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780I4L disebabkan oleh Intel dan EP3SE260H780C4LN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Bahagian terakhir untuk beli
Intel
EP3SE260H780C4LN EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel

EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel

EP3SE260H780C4LN ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260H780I4L EP3SE260H780C4LN
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Masa Terakhir Dibeli
Family Stratix III E (Enhanced) Stratix III E
Logic Elements 255,000 255,000
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 488
Core Voltage 0.9 V —
Process Technology 65 nm —
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Jenis Pemasangan Surface Mount (flip-chip) —
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Suhu Operasi Industrial, -40C to +85C 0C to +85C (commercial)
Status RoHS Compliant (lead-free) Compliant
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Logic Array Blocks (LABs) — 10,200
Embedded Multipliers (18x18) — 384
Kemasan — 780-ball FCBGA (FineLine BGA)
Speed Grade — C4 (commercial, moderate speed)
Core Voltage (VCC) — 1.0 V
I/O Voltage (VCCIO) — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Auxiliary Voltage (VCCPD/VCCPT) — 2.5 V / 3.0 V
PLLs — 8
Global Clock Networks — 16
Process Node — 40 nm TSMC
Configuration Modes — FPP, AS, PS, JTAG
Aras MSL — 3 (168 hours)

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