EP3SE50F484C2G vs EP3SL50F484C2G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484C2G disebabkan oleh Intel dan EP3SL50F484C2G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel
EP3SE50F484C2G ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE50F484C2G | EP3SL50F484C2G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Series | Stratix III E | — |
| Number of Logic Elements / Cells | 47,500 | — |
| Number of LABs / CLBs | 1,900 | — |
| Total RAM Bits | 5,760,000 (5,760 Kbit) | — |
| Number of User I/O | 296 | — |
| Kemasan / Case | 484-BBGA, FCBGA (FineLine BGA) | — |
| Jenis Pemasangan | Surface Mount | — |
| Core Voltage Supply | 0.86 V to 1.15 V | — |
| Suhu Operasi | 0 °C to +85 °C (TJ) | — |
| Process Technology | 40 nm TSMC low-power CMOS | 65 nm CMOS |
| Logic Element Architecture | Adaptive Logic Module (ALM) with 8-input fracturable LUT | — |
| Embedded DSP Blocks | Yes (variable-precision multipliers) | — |
| Transceivers | Multi-gigabit transceivers (selected package pins) | — |
| Memory Interface Support | DDR / DDR2 / DDR3 with hard PHY | — |
| Partial Reconfiguration | Supported | — |
| Configuration Interface | JTAG, Passive Serial, Fast Passive Parallel | — |
| Part Status | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy | — |
| Status RoHS | Compliant | Compliant |
| Family | — | Stratix III L |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 2,184,192 bits (2.08 Mbit) |
| Maximum User I/Os | — | 296 I/O |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Maximum Operating Temperature | — | +85 C |
| Minimum Operating Temperature | — | 0 C |
| Frekuensi Klock Maksimum | — | 600 MHz |
| Kemasan | — | 484-ball FCBGA (FBGA-484) |
| Gaya Pemasangan | — | SMD/SMT |
| Packaging | — | Tray |
| Total Transceivers | — | [DATA_NEEDED: transceiver count] |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |