EP3SE50F484I3 vs EP3SE50F484C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484I3 disebabkan oleh Intel dan EP3SE50F484C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F484I3 | EP3SE50F484C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E FPGA |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory | 5,760 Kbits | 2,304 Kbits |
| User I/Os | 296 | 296 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 0.9 V / 1.1 V |
| Kemasan | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | I3 (-3 speed bin, industrial) | — |
| DSP Blocks | Yes (embedded multipliers and accumulators) | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| PLLs | Yes (multiple, for clock management) | — |
| I/O Standards | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | Multi-gigabit transceivers supported | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Series | — | Stratix III E |
| DSP Blocks (18x18) | — | 264 |
| LABs/CLBs | — | 1,900 |
| Internal Frequency | — | 600 MHz |
| Suhu Operasi | — | 0C to +85C (Commercial) |