EP3SE50F484I3 vs EP3SE50F484C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I3 sa pamamagitan ng Intel at EP3SE50F484C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484I3 | EP3SE50F484C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III E FPGA |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory | 5,760 Kbits | 2,304 Kbits |
| User I/Os | 296 | 296 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 0.9 V / 1.1 V |
| Packhaging | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | I3 (-3 speed bin, industrial) | — |
| DSP Blocks | Yes (embedded multipliers and accumulators) | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| PLLs | Yes (multiple, for clock management) | — |
| I/O Standards | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | Multi-gigabit transceivers supported | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Series | — | Stratix III E |
| DSP Blocks (18x18) | — | 264 |
| LABs/CLBs | — | 1,900 |
| Internal Frequency | — | 600 MHz |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |