EP3SE50F780C3N vs EP3SE50F780C4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780C3N disebabkan oleh Intel dan EP3SE50F780C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE50F780C3N EP3SE50F780C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III E Stratix III E
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Embedded Memory (M9K blocks) 312 —
Total Embedded Memory 5,760 Kbit (5.76 Mbit) —
DSP Blocks 432 —
Maximum User I/Os 488 488
Number of PLLs 4 —
Process Technology 65 nm —
Core Voltage 1.1 V —
Speed Grade C3 (medium) —
Temperature Grade Commercial (0C to +85C) —
Kemasan 780-ball FC-FBGA 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Status RoHS Compliant Lead-free / RoHS compliant
Lead-Free Yes —
Logic Elements (LE) — 47,500
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
DSP Blocks (18x18 multipliers) — 432
PLLs — 12 (per family datasheet)
Maximum Operating Frequency — 717 MHz
Transceiver Channels — Up to 12 (per family, model-dependent)
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Process Node — 40 nm
Tegangan Pemberi Arus — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
Suhu Operasi — 0C to +85C (C4 commercial grade)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
Aras MSL — 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

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