EP3SE50F780C3N vs EP3SE50F780C4N 比較

詳細並排比較 EP3SE50F780C3N 由 Intel 與 EP3SE50F780C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F780C3N EP3SE50F780C4N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E Stratix III E
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Embedded Memory (M9K blocks) 312 —
Total Embedded Memory 5,760 Kbit (5.76 Mbit) —
DSP Blocks 432 —
Maximum User I/Os 488 488
Number of PLLs 4 —
Process Technology 65 nm —
Core Voltage 1.1 V —
Speed Grade C3 (medium) —
Temperature Grade Commercial (0C to +85C) —
封裝 780-ball FC-FBGA 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
安裝類型 Surface Mount Surface Mount (BGA)
RoHS 狀態 Compliant Lead-free / RoHS compliant
Lead-Free Yes —
Logic Elements (LE) — 47,500
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
DSP Blocks (18x18 multipliers) — 432
PLLs — 12 (per family datasheet)
Maximum Operating Frequency — 717 MHz
Transceiver Channels — Up to 12 (per family, model-dependent)
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Process Node — 40 nm
供應電壓 — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
工作溫度 — 0C to +85C (C4 commercial grade)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
MSL 等級 — 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

資料表與資源

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