EP3SE80F1152I4N vs EP3SE80F1152C4LN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE80F1152I4N disebabkan oleh Intel dan EP3SE80F1152C4LN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
EP3SE80F1152I4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE80F1152I4N | EP3SE80F1152C4LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 80,000 | — |
| Embedded Memory Bits | 6,843,392 bits | — |
| User I/O Count | 744 | — |
| Kemasan | 1152-BBGA, FCBGA (flip-chip) | 1152-BBGA, FCBGA (FBGA-1152) |
| Process Technology | 65 nm CMOS | CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 450 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Speed Grade | I4 | — |
| Jenis Ingatan | SRAM-based configuration | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel (IEEE 1149.1 BST) | — |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL, PCI, PCI-X | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Logic Elements (LE) | — | 80,000 |
| LABs / CLBs | — | 3200 |
| Embedded Memory (bits) | — | 6,843,392 |
| Total RAM Bits | — | 6,843,392 |
| User I/O (per datasheet) | — | 744 |
| User I/O (JAK comparison) | — | 488 (alternate listing) |
| Operating Frequency (max) | — | 717 MHz |
| Number of GPIOs | — | 744 |
| Tegangan Pemberi Arus | — | 0.9 V to 1.1 V core (with 2.5 V / 3.0 V aux) |
| Lead Free | — | Yes |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature grade] |