EP3SE80F780I3N vs EP3SE110F780I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE80F780I3N disebabkan oleh Intel dan EP3SE110F780I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE80F780I3N - 80K LEs Stratix III E FPGA, 488 I/O, 780-FBGA | Intel
EP3SE80F780I3N ⚠ Bahagian terakhir untuk beliIntel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N NrndPengandingan Spesifikasi
| Parametr | EP3SE80F780I3N | EP3SE110F780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 80,000 | 107,500 |
| Embedded Memory Bits | 6,843,392 | 8,936,448 (approximately 1.1 MB) |
| Maximum User I/O | 488 | — |
| Core Voltage | 1.1 V | 1.1 V (range 1.05 V to 1.15 V) |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Kemasan | 780-ball FBGA (FCBGA) | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Number of Pins / Balls | 780 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Maximum Core Frequency | 500 MHz | — |
| Configuration Method | JTAG, Active Serial, Passive Serial, Fast Passive Parallel | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| JESD-609 Code | e1 | — |
| Package Terminal Form | Ball | — |
| Package Code | BGA | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| Maximum User I/Os | — | 488 |
| Suhu Operasi | — | -40 °C to +100 °C (Industrial, "I" grade) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| Speed Grade | — | 3 (Fast) |
| PLLs | — | Yes, with global and regional clock networks |
| Status RoHS | — | Compliant |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |