EP3SL340F1760I4 vs EP3SL340F1760I3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL340F1760I4 disebabkan oleh Intel dan EP3SL340F1760I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL340F1760I3 EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel

EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel

EP3SL340F1760I3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL340F1760I4 EP3SL340F1760I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Series Stratix III L Stratix III L
Logic Elements / Cells 337,500 —
Total RAM Bits 18,821,144 bits —
Number of LABs/CLBs 13,500 —
Number of Logic Elements / Cells 337,500 —
Number of I/O 1,120 —
Voltage - Supply 1.1 V core —
Suhu Operasi -40C to +100C (industrial) -40 °C to 100 °C (Industrial grade, I3 suffix)
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Kemasan / Case 1760-BBGA, FCBGA (flip-chip fine-pitch BGA) —
Process Technology 65 nm TSMC 65 nm
Maximum Frequency 450 MHz —
Speed Grade I4 (industrial) I3 (Industrial, mid-speed bin)
Configuration Method SRAM (in-system reconfigurable) —
Status RoHS Compliant (lead-free) Compliant (Pb-free BGA balls)
Logic Elements — 337,500 LE
LABs (Logic Array Blocks) — 13,500
Embedded Memory Bits — 18,822,144 bit
User I/Os — 1120
Number of Pins / Balls — 1760
Package Type — FC-FBGA (1760-ball, FineLine BGA)
Package Code — BGA1760, 42x42, 40
Core Voltage — 1.1 V
Configuration Memory — SRAM-based, volatile (requires external configuration device)
Transceivers — [DATA_NEEDED: transceiver count and data rate for this F1760 variant]
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
PLLs — [DATA_NEEDED: PLL count]
Aras MSL — MSL3 (JEDEC J-STD-020, reflow 245 °C peak)

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