EP3SL340F1760I4 vs EP3SL340F1760I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL340F1760I4 sa pamamagitan ng Intel at EP3SL340F1760I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL340F1760I4 EP3SL340F1760I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Huling Pagbili
Series Stratix III L Stratix III L
Logic Elements / Cells 337,500 —
Total RAM Bits 18,821,144 bits —
Number of LABs/CLBs 13,500 —
Number of Logic Elements / Cells 337,500 —
Number of I/O 1,120 —
Voltage - Supply 1.1 V core —
Temperature na Operasyon -40C to +100C (industrial) -40 °C to 100 °C (Industrial grade, I3 suffix)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Packhaging / Kaso 1760-BBGA, FCBGA (flip-chip fine-pitch BGA) —
Process Technology 65 nm TSMC 65 nm
Maximum Frequency 450 MHz —
Speed Grade I4 (industrial) I3 (Industrial, mid-speed bin)
Configuration Method SRAM (in-system reconfigurable) —
Tindminan RoHS Compliant (lead-free) Compliant (Pb-free BGA balls)
Logic Elements — 337,500 LE
LABs (Logic Array Blocks) — 13,500
Embedded Memory Bits — 18,822,144 bit
User I/Os — 1120
Number of Pins / Balls — 1760
Package Type — FC-FBGA (1760-ball, FineLine BGA)
Package Code — BGA1760, 42x42, 40
Core Voltage — 1.1 V
Configuration Memory — SRAM-based, volatile (requires external configuration device)
Transceivers — [DATA_NEEDED: transceiver count and data rate for this F1760 variant]
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
PLLs — [DATA_NEEDED: PLL count]
Level ng MSL — MSL3 (JEDEC J-STD-020, reflow 245 °C peak)

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