EP3SL70F484C4LG vs EP3SL70F484I3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F484C4LG disebabkan oleh Intel dan EP3SL70F484I3G disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL70F484C4LG EP3SL70F484C4LG - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484C4LG - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484C4LG ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL70F484C4LG EP3SL70F484I3G
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Series Stratix III L Stratix III L
Family Stratix III (Low Static Power) Stratix III (low-power variant)
Logic Elements 67,500 LE —
Adaptive Logic Modules (ALMs) 27,000 ALM —
Embedded Memory 2,699,264 bit (2.57 Mbit) —
User I/O Count 296 —
Kemasan 484-pin FBGA (Flip-Chip BGA) —
Jenis Pemasangan Surface Mount Surface Mount
Core Voltage 1.1 V 1.0 V
Suhu Operasi 0 C to +85 C (Commercial) —
Speed Grade 4 I3
Process Node 40 nm —
Status RoHS Compliant Compliant
Packaging Tray —
Multi-Gigabit Transceivers None (L family) —
DSP Blocks Yes (variable-precision) [DATA_NEEDED: DSP block count]
Logic Elements (LE) — 67,500
ALMs (Adaptive Logic Modules) — [DATA_NEEDED: ALM count]
Total Memory Bits — 2,699,264
User I/O Pins — 296
Transceivers — 24
Maximum Transceiver Data Rate — [DATA_NEEDED: max transceiver Gbps]
Package Type — 484-ball FCBGA (Fine-pitch Chip-Scale BGA)
Package Pin Count — 484
Gambaran Suhu Operasi — -40C to +100C (Industrial)
Process Technology — 40 nm TSMC
Aras MSL — [DATA_NEEDED: MSL level]
Configuration Interface — JTAG / Serial Passive / Active Serial

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