EP3SL70F780I4L vs EP3SL70F780I4LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780I4L disebabkan oleh Intel dan EP3SL70F780I4LG disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F780I4L | EP3SL70F780I4LG |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 LE |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | — |
| User I/O Pins | 488 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | — |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial, I4) |
| Speed Grade | I4 | — |
| Power Variant | L (low static power) | — |
| Process Node | 40 nm | — |
| Configuration Method | Serial / Parallel / JTAG via Quartus II | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Present (refer to device handbook) |
| Transceivers | None (logic/transceiver-less L variant) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Compliant | Compliant |
| Adaptive Logic Modules (ALMs) | — | 27,000 ALM |
| Embedded Memory | — | 2.57 Mbit |
| Number of I/Os | — | 488 I/O |
| Core Voltage | — | 1.1 V |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip) |
| Process Technology | — | 40 nm |
| Gaya Pemasangan | — | SMD/SMT |
| Number of Logic Array Blocks (LABs) | — | 2700 |
| Total Block RAM Bits | — | 2,699,264 bits |
| Ordering Code Suffix 'G' | — | Indicates Flip-Chip BGA package |