EP3SL70F780I4N vs EP3SL70F780C2G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780I4N disebabkan oleh Intel dan EP3SL70F780C2G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F780I4N | EP3SL70F780C2G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L (low-power) | Stratix III L |
| Logic Elements (LE) | 67,500 | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | — |
| User I/Os | 488 | — |
| Kemasan | 780-Ball FC-FBGA (29x29 mm) | 780-ball FCBGA (FineLine BGA) |
| Process Technology | 65 nm CMOS | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| Maximum Operating Frequency | 500 MHz | — |
| Transceivers | 24 channels | [DATA_NEEDED: transceiver count and data rate] |
| DSP Blocks | Yes (18x18 multipliers) | Yes (dedicated) |
| Suhu Operasi | -40C to +100C (Industrial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Speed Grade | I4 (faster) | C2 (medium) |
| Lead-Free | Yes | — |
| Logic Elements | — | 67,500 |
| Embedded Memory | — | 2,699,264 bits |
| User I/O Count | — | 488 |
| Temperature Grade | — | Commercial (0 C to 85 C) |
| Process Node | — | 40 nm low-power CMOS |
| Core Voltage (VCC) | — | 0.9 V |
| Memory Interfaces Supported | — | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | Gen1/Gen2 |
| PLLs | — | Fractional PLLs |