EP3SL70F780I4N vs EP3SL70F780C2G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I4N sa pamamagitan ng Intel at EP3SL70F780C2G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780I4N | EP3SL70F780C2G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III L (low-power) | Stratix III L |
| Logic Elements (LE) | 67,500 | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | — |
| User I/Os | 488 | — |
| Packhaging | 780-Ball FC-FBGA (29x29 mm) | 780-ball FCBGA (FineLine BGA) |
| Process Technology | 65 nm CMOS | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| Maximum Operating Frequency | 500 MHz | — |
| Transceivers | 24 channels | [DATA_NEEDED: transceiver count and data rate] |
| DSP Blocks | Yes (18x18 multipliers) | Yes (dedicated) |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Speed Grade | I4 (faster) | C2 (medium) |
| Lead-Free | Yes | — |
| Logic Elements | — | 67,500 |
| Embedded Memory | — | 2,699,264 bits |
| User I/O Count | — | 488 |
| Temperature Grade | — | Commercial (0 C to 85 C) |
| Process Node | — | 40 nm low-power CMOS |
| Core Voltage (VCC) | — | 0.9 V |
| Memory Interfaces Supported | — | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | Gen1/Gen2 |
| PLLs | — | Fractional PLLs |