EP4CE55F29C6N vs EP4CE40F29C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F29C6N disebabkan oleh Intel dan EP4CE40F29C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F29C6N | EP4CE40F29C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | 39,600 |
| Logic Array Blocks (LABs) | 3491 | — |
| Total Memory Bits | 239,6160 | — |
| Embedded 18x18 Multipliers | 374 | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| PLLs | 4 | 4 general-purpose |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O count for F29 package] | — |
| Core Voltage | 1.2 V | 1.2 V (internal regulated) |
| I/O Voltage Support | 1.2 V to 3.3 V | — |
| Process Technology | 60 nm low-power | — |
| Kemasan | 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Configuration Methods | JTAG, Passive Serial (PS), Active Serial (AS) with EPCS | — |
| Status RoHS | Lead-free, RoHS compliant | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Embedded Memory (bits) | — | 1,161,216 |
| Embedded Memory Blocks | — | 113 M9K blocks |
| 18x18 Hardware Multipliers | — | 66 |
| Maximum User I/Os | — | 532 |
| Process Node | — | 60 nm |
| Suhu Operasi | — | 0°C to +85°C (commercial) |
| Speed Grade | — | 6 |
| Configuration Modes | — | Serial, JTAG, Passive Serial, AS |
| Aras MSL | — | 3 |