EP4CE55F29C6N vs EP4CE55F29C8L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F29C6N disebabkan oleh Intel dan EP4CE55F29C8L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F29C6N | EP4CE55F29C8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | 55,856 |
| Logic Array Blocks (LABs) | 3491 | — |
| Total Memory Bits | 239,6160 | — |
| Embedded 18x18 Multipliers | 374 | 156 |
| Maximum Operating Frequency | 472.5 MHz | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O count for F29 package] | 374 |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V | — |
| Process Technology | 60 nm low-power | 60 nm (low-power) |
| Kemasan | 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Configuration Methods | JTAG, Passive Serial (PS), Active Serial (AS) with EPCS | — |
| Status RoHS | Lead-free, RoHS compliant | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Embedded Memory Bits | — | 2,396,160 bits |
| Embedded Memory (M9K Blocks) | — | 260 blocks |
| Speed Grade | — | C8 (commercial, 8 speed bin) |
| Suhu Operasi | — | 0C to +85C (commercial, 'L' suffix) |
| Configuration Schemes | — | AS, PS, JTAG, FPP |
| JTAG (IEEE 1149.1) | — | Supported |
| Configuration Memory | — | SRAM-based (external flash required) |