EP4CE55F29C6N vs EP4CE55F29C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F29C6N disebabkan oleh Intel dan EP4CE55F29C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F29C6N | EP4CE55F29C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Logic Array Blocks (LABs) | 3491 | 3,491 |
| Total Memory Bits | 239,6160 | — |
| Embedded 18x18 Multipliers | 374 | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| PLLs | 4 | 4 to 8 (per device) |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O count for F29 package] | 374 |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V | — |
| Process Technology | 60 nm low-power | 60 nm (TSMC low-power) |
| Kemasan | 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Configuration Methods | JTAG, Passive Serial (PS), Active Serial (AS) with EPCS | — |
| Status RoHS | Lead-free, RoHS compliant | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,340 Kbits |
| Embedded Multiplier Blocks (18x18) | — | 154 |
| Speed Grade | — | 8 (commercial) |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Configuration Method | — | SRAM-based, volatile (requires external config device) |
| Lead-Free / Halogen-Free | — | Yes (per part marking) |