EP4CE6E22C7 vs EP4CE6E22A7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE6E22C7 disebabkan oleh Intel dan EP4CE6E22A7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE6E22C7 | EP4CE6E22A7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV E | Cyclone IV E |
| Family | Cyclone IV | — |
| Core Architecture | Logic Elements (LE) | — |
| Number of Logic Elements (LEs) | 6,272 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Number of Configurable Logic Blocks (CLBs) | 392 | — |
| Total Embedded Memory Bits | 276,480 | — |
| Total RAM (Kbits) | 270 | — |
| Number of Embedded 18x18 Multipliers | 15 | — |
| Number of PLLs | 4 | 2 |
| User I/O Count | 91 | — |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL, PCI | — |
| Operating Supply Voltage (Core) | 1.0 V to 1.2 V (typ. 1.2 V) | — |
| Operating Supply Voltage (I/O) | 1.2 V to 3.3 V | — |
| Logic Speed Grade | C7 | — |
| Operating Temperature Range (Commercial) | 0°C to +85°C (junction) | — |
| Kemasan | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | JTAG, AS, PS, FPP |
| Process Technology | 60 nm low-power CMOS | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 6,272 |
| Embedded Memory (bits) | — | 276,480 |
| Embedded Multipliers (18x18) | — | 15 |
| User I/O Pins | — | 91 |
| Number of I/O Banks | — | 4 |
| Global Clock Networks | — | 10 |
| Process Node | — | 60 nm low power |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Automotive A7 (-40C to +125C junction) |
| Package Type | — | 144-pin EQFP (E22) with exposed pad |