EP4CE6E22C7 vs EP4CE6E22A7N Perbandingan
Perbandingan bersamaan detil EP4CE6E22C7 dari Intel dan EP4CE6E22A7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE6E22C7 | EP4CE6E22A7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV E | Cyclone IV E |
| Family | Cyclone IV | — |
| Core Architecture | Logic Elements (LE) | — |
| Number of Logic Elements (LEs) | 6,272 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Number of Configurable Logic Blocks (CLBs) | 392 | — |
| Total Embedded Memory Bits | 276,480 | — |
| Total RAM (Kbits) | 270 | — |
| Number of Embedded 18x18 Multipliers | 15 | — |
| Number of PLLs | 4 | 2 |
| User I/O Count | 91 | — |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL, PCI | — |
| Operating Supply Voltage (Core) | 1.0 V to 1.2 V (typ. 1.2 V) | — |
| Operating Supply Voltage (I/O) | 1.2 V to 3.3 V | — |
| Logic Speed Grade | C7 | — |
| Operating Temperature Range (Commercial) | 0°C to +85°C (junction) | — |
| Paket | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | JTAG, AS, PS, FPP |
| Process Technology | 60 nm low-power CMOS | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 6,272 |
| Embedded Memory (bits) | — | 276,480 |
| Embedded Multipliers (18x18) | — | 15 |
| User I/O Pins | — | 91 |
| Number of I/O Banks | — | 4 |
| Global Clock Networks | — | 10 |
| Process Node | — | 60 nm low power |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Automotive A7 (-40C to +125C junction) |
| Package Type | — | 144-pin EQFP (E22) with exposed pad |