EP4CGX50CF23C7N vs EP4CGX50CF23C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX50CF23C7N disebabkan oleh Intel dan EP4CGX50CF23C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX50CF23C7N | EP4CGX50CF23C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) | — |
| User I/O | 290 | — |
| Logic Array Blocks | 47 | — |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps | — |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) | — |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) | — |
| Kemasan | 484-FBGA (F23, 23 x 23 mm) | 484-FBGA (F23) |
| Speed Grade | C7 (commercial) | C7 |
| Suhu Operasi | -40C to +85C (commercial) | — |
| Process Technology | 60 nm TSMC low-power | 60 nm |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel | — |
| Status RoHS | Compliant (lead-free) | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount (FBGA) |
| Logic Elements | — | 49,888 |
| Logic Cells | — | 49,888 |
| Embedded Memory Bits | — | 2,562,048 bits |
| Embedded Memory Blocks | — | M9K blocks, 9 Kbit each |
| Maximum User I/O | — | 290 |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | Commercial (0C to +85C) |
| Transceivers | — | Integrated (Cyclone IV GX) |
| DSP Blocks | — | 18x18 hardware multipliers |