EP4CGX50CF23C7N vs EP4CGX50CF23C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50CF23C7N sa pamamagitan ng Intel at EP4CGX50CF23C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50CF23C7N | EP4CGX50CF23C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) | — |
| User I/O | 290 | — |
| Logic Array Blocks | 47 | — |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps | — |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) | — |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) | — |
| Packhaging | 484-FBGA (F23, 23 x 23 mm) | 484-FBGA (F23) |
| Speed Grade | C7 (commercial) | C7 |
| Temperature na Operasyon | -40C to +85C (commercial) | — |
| Process Technology | 60 nm TSMC low-power | 60 nm |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel | — |
| Tindminan RoHS | Compliant (lead-free) | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (FBGA) |
| Logic Elements | — | 49,888 |
| Logic Cells | — | 49,888 |
| Embedded Memory Bits | — | 2,562,048 bits |
| Embedded Memory Blocks | — | M9K blocks, 9 Kbit each |
| Maximum User I/O | — | 290 |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | Commercial (0C to +85C) |
| Transceivers | — | Integrated (Cyclone IV GX) |
| DSP Blocks | — | 18x18 hardware multipliers |