EP4CGX50DF27I6N vs EP4CGX50DF27I8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX50DF27I6N disebabkan oleh Intel dan EP4CGX50DF27I8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ Aktif
Pengandingan Spesifikasi
| Parametr | EP4CGX50DF27I6N | EP4CGX50DF27I8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | — |
| Process Technology | 60 nm low-power | 60 nm |
| Core Voltage | 1.2 V | — |
| Embedded Memory | 2,502 Kbits | — |
| Embedded Multipliers (18x18) | 113 | — |
| Maximum User I/O | 310 | — |
| Transceiver Channels | 8 | 8 (up to 3.125 Gbps) |
| Transceiver Data Rate | up to 3.125 Gbps | — |
| General-purpose PLLs | 4 | — |
| Kemasan | 672-ball FBGA (F27) | 672-ball FineLine BGA (F27) |
| Operating Temperature (Industrial grade) | -40C to +100C junction | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 49,888 |
| Embedded Memory (bits) | — | 2,562,048 |
| Embedded Memory Blocks | — | 250 x M9K |
| 18 x 18 Multipliers | — | 200 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O Pins | — | 310 |
| PCI Express Hard IP | — | Gen1 x1/x2/x4 |
| Core Supply Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | — | 8 (fastest) |
| Temperature Grade | — | Industrial (-40 C to +100 C) |