EP4CGX50DF27I6N vs EP4CGX50DF27I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27I6N sa pamamagitan ng Intel at EP4CGX50DF27I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ NakahandaIntel
EP4CGX50DF27I8N - Cyclone IV GX FPGA, 49,888 LEs, 672-FBGA | Intel
EP4CGX50DF27I8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX50DF27I6N | EP4CGX50DF27I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | — |
| Process Technology | 60 nm low-power | 60 nm |
| Core Voltage | 1.2 V | — |
| Embedded Memory | 2,502 Kbits | — |
| Embedded Multipliers (18x18) | 113 | — |
| Maximum User I/O | 310 | — |
| Transceiver Channels | 8 | 8 (up to 3.125 Gbps) |
| Transceiver Data Rate | up to 3.125 Gbps | — |
| General-purpose PLLs | 4 | — |
| Packhaging | 672-ball FBGA (F27) | 672-ball FineLine BGA (F27) |
| Operating Temperature (Industrial grade) | -40C to +100C junction | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 49,888 |
| Embedded Memory (bits) | — | 2,562,048 |
| Embedded Memory Blocks | — | 250 x M9K |
| 18 x 18 Multipliers | — | 200 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O Pins | — | 310 |
| PCI Express Hard IP | — | Gen1 x1/x2/x4 |
| Core Supply Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | — | 8 (fastest) |
| Temperature Grade | — | Industrial (-40 C to +100 C) |