EP4SGX360FF35I3 vs EP4SGX360FF35C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360FF35I3 disebabkan oleh Intel dan EP4SGX360FF35C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX360FF35I3 | EP4SGX360FF35C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | 23105536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | 8 |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Suhu Operasi | -40C to +100C | 0C to +85C (commercial) |
| Kemasan | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (flip-chip) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Speed Grade | I3 | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Aras MSL | [DATA_NEEDED: MSL] | 3 (per JEDEC J-STD-020) |
| Logic Elements | — | 353600 |
| Number of LABs/CLBs | — | 14144 |
| Number of I/O | — | 564 |
| Lead-Free | — | Yes (per BGA finish) |
| Supplier Device Package | — | 1152-FBGA |