EP4SGX360HF35C2 vs EP4SGX360HF35C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360HF35C2 disebabkan oleh Intel dan EP4SGX360HF35C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX360HF35C2 | EP4SGX360HF35C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX FPGA | — |
| Logic Elements (LEs) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Number of I/O | 564 (max 532 user I/O) | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Cells | 353,600 | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Transceivers | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) | Multi-gigabit serial transceivers integrated |
| Package Type | 1152-pin FC-FBGA | — |
| Package Code | HF35 (35x35 mm, 1.0 mm pitch) | — |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Suhu Operasi | 0C to +85C (commercial) | Commercial (0C to +85C) - inferred from C3 suffix |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Configuration | JTAG / Active Serial (external config device) | — |
| Design Tool | Quartus II / Quartus Prime | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 353,600 |
| Total Memory Bits | — | 23,105,536 (22.5 Mbit) |
| Number of LABs | — | 14,144 |
| User I/O Count | — | 564 |
| Kemasan | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Process Node | — | 40 nm |
| Supply Voltage - Core | — | [DATA_NEEDED: core voltage] |
| DSP Blocks | — | Variable-precision DSP blocks |
| Memory Controllers | — | Hard memory controller blocks |
| PCI Express Hard IP | — | Yes (PCIe Gen2 capable per family) |
| Development Tool | — | Quartus II Design Software (v13.0 or later) |