EP4SGX360KF43C3N vs EP4SGX530KF43C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360KF43C3N disebabkan oleh Intel dan EP4SGX530KF43C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP4SGX530KF43C3 - Stratix IV GX FPGA, 531K LE, 1760-BGA | Intel
EP4SGX530KF43C3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP4SGX360KF43C3N | EP4SGX530KF43C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Cells | 353600 | — |
| Configurable Logic Blocks | 141440 CLBs | — |
| User I/O | 880 I/O | — |
| Embedded Memory | 23105536 bits | 28,033,024 bits (approximately 27.4 Mbits / 3,424 Kbits per block RAM array) |
| DSP Multiplier Configurations | 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit | — |
| Maximum DSP Multiplier Frequency | 600 MHz | — |
| Additional Distributor Frequency Figure | 717 MHz | — |
| Process Technology | CMOS | 40 nm |
| Kemasan | 1760-ball FCBGA/BGA | 1760-ball FC-FBGA (KF43) |
| Terminal Form | Ball | — |
| Number of Terminals | 1760 | — |
| Package Shape | Square | — |
| Package Code | BGA | — |
| Grading of Temperature | Other | — |
| Lead-Free | Lead free | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance status] | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: operating temperature range] | 0C to +85C (commercial, 'C' suffix) |
| Logic Elements | — | 531,200 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| DSP Blocks (18x18 multipliers) | — | 880 |
| Maximum User I/O Pins | — | [DATA_NEEDED: pin count from KF43 BGA map] |
| Number of Transceivers | — | 24 (up to 8.5 Gbps per channel) |
| PLLs | — | 8 |
| PCIe Hard IP Blocks | — | 4 (Gen1/Gen2 capable) |
| Core Voltage (VCC) | — | 0.9 V |
| Speed Grade | — | C3 |
| Jenis Pemasangan | — | Surface Mount (flip-chip BGA) |
| Configuration Method | — | Active serial (EPCS), passive serial, JTAG, Fast Passive Parallel |
| Status RoHS | — | Compliant (Pb-free) |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |