EP4SGX530HH35C2NES vs EP4SGX530HH35C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX530HH35C2NES disebabkan oleh Altera dan EP4SGX530HH35C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX530HH35C2NES | EP4SGX530HH35C4 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix IV GX | — |
| Device Logic Elements | 531,200 | — |
| Logic Cells / Logic Blocks | 21248 (per FindIC summary) | — |
| Total Memory Bits | 28,033,024 | — |
| User I/O Count | 564 | — |
| Operating Voltage (Core) | 0.9 V | — |
| Process Technology | 40 nm | 40 nm |
| Kemasan | 1152-ball FC-HFBGA (Flip-Chip), 42.5 x 42.5 mm | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Bilangan Pin | 1152 | — |
| Internal Frequency (max) | 800 MHz | — |
| Suhu Operasi | 0 C to 85 C (commercial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Configuration Method | Passive / Active / JTAG | — |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Aras MSL | [DATA_NEEDED: msl level] | MSL3 (per BGA package standard) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Series | — | Stratix IV GX |
| Device Type | — | FPGA |
| Logic Elements | — | 531,200 |
| Adaptive Logic Modules (ALMs) | — | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory (bits) | — | 28,033,024 |
| Maximum User I/O Pins | — | 564 |
| Core Supply Voltage | — | 0.9 V |
| Speed Grade | — | HH35 |
| Transceivers | — | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | — | [DATA_NEEDED: block count for this density] |
| PLLs | — | 8 fractional PLLs |