EP4SGX530HH35C4 vs EP4SGX530HH35C2NES Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX530HH35C4 disebabkan oleh Intel dan EP4SGX530HH35C2NES disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX530HH35C4 | EP4SGX530HH35C2NES |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix IV GX | — |
| Device Type | FPGA | — |
| Logic Elements | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Maximum User I/O Pins | 564 | — |
| Process Technology | 40 nm | 40 nm |
| Core Supply Voltage | 0.9 V | — |
| Kemasan | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-ball FC-HFBGA (Flip-Chip), 42.5 x 42.5 mm |
| Speed Grade | HH35 | — |
| Suhu Operasi | 0 C to 85 C (Commercial, -C4 suffix) | 0 C to 85 C (commercial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | — |
| DSP Blocks | [DATA_NEEDED: block count for this density] | — |
| PLLs | 8 fractional PLLs | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Aras MSL | MSL3 (per BGA package standard) | [DATA_NEEDED: msl level] |
| Status RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Family | — | Stratix IV GX |
| Device Logic Elements | — | 531,200 |
| Logic Cells / Logic Blocks | — | 21248 (per FindIC summary) |
| Total Memory Bits | — | 28,033,024 |
| User I/O Count | — | 564 |
| Operating Voltage (Core) | — | 0.9 V |
| Bilangan Pin | — | 1152 |
| Internal Frequency (max) | — | 800 MHz |
| Configuration Method | — | Passive / Active / JTAG |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |