EP4SGX530HH35C4 vs EP4SGX530HH35C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX530HH35C4 disebabkan oleh Intel dan EP4SGX530HH35C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX530HH35C4 | EP4SGX530HH35C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA | — |
| Logic Elements | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Maximum User I/O Pins | 564 | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Supply Voltage | 0.9 V | — |
| Kemasan | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-BBGA / FCBGA (HFBGA) |
| Speed Grade | HH35 | C3 |
| Suhu Operasi | 0 C to 85 C (Commercial, -C4 suffix) | 0C to +85C (Commercial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | 24 channels, up to 8.5 Gbps |
| DSP Blocks | [DATA_NEEDED: block count for this density] | 1024 (18x18 multipliers) |
| PLLs | 8 fractional PLLs | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount |
| Aras MSL | MSL3 (per BGA package standard) | — |
| Status RoHS | Compliant | Compliant |
| Family | — | Stratix IV |
| Logic Elements (LE) | — | 531,200 |
| LABs / CLBs | — | 21,248 |
| Total RAM Bits | — | 28,033,024 |
| User I/O Count | — | 564 |
| Core Voltage | — | 0.87 V to 0.93 V |