EP4SGX530HH35I3N vs EP4SGX530HH35I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX530HH35I3N disebabkan oleh Intel dan EP4SGX530HH35I3 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX530HH35I3N | EP4SGX530HH35I3 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Logic Blocks / LABs | 21,248 | — |
| Maximum User I/Os | 564 | — |
| DSP Blocks | 1,024 (18x18 multipliers) | — |
| Transceivers | 24 channels | Multi-gigabit transceivers up to 8.5 Gbps |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PLLs | 8 (fractional support) | — |
| Suhu Operasi | -40C to +85C (industrial) | 0 °C to 85 °C (Industrial) |
| Internal Frequency (max) | 800 MHz | — |
| Kemasan | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1152-BBGA, FCBGA (42.5 x 42.5 mm, HBGA) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | RoHS non-compliant (contains lead per legacy BGA package) |
| Lead-Free | Yes | — |
| Aras MSL | 3 | [DATA_NEEDED: MSL level] |
| Process Node | 40 nm | 40 nm |
| Adaptive Logic Modules / LABs | — | 21,248 |
| Embedded Memory | — | 28,033,024 bits (28 Mb) |
| User I/O Pins | — | 564 |
| Core Supply Voltage | — | 1.0 V (typical) |
| Internal Logic Frequency | — | 800 MHz (max) |
| Configuration | — | JTAG, Passive Serial, Fast Passive Parallel |
| Jenis Ingatan | — | SRAM-based (volatile, requires configuration) |