EPF10K130EFC672-2 vs EPF10K250EFC672-1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K130EFC672-2 disebabkan oleh Altera dan EPF10K250EFC672-1 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K130EFC672-2 | EPF10K250EFC672-1 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 6,656 | — |
| Total Gates | ~130,000 | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (RAM bits) | 65,536 | — |
| Maximum User I/Os | 413 | 470 |
| Number of I/O Pins | 672 (package pins) | — |
| Kemasan | 672-ball FineLine BGA | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | — |
| Propagation Delay (typ.) | 0.6 ns | — |
| Internal Operating Frequency (max) | 333.33 MHz | — |
| Suhu Operasi | 0 °C to +70 °C (Commercial) | 0C to +70C (Commercial) |
| Speed Grade | -2 | -1 |
| Programming Method | SRAM-based, JTAG (IEEE 1149.1) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Logic Family | — | CMOS |
| Typical System Gates | — | 250,000 |
| Total Pins | — | 672 |
| Package Type | — | BGA-672 |
| Package Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Propagation Delay | — | 0.4 ns |
| Programming Technology | — | In-system, SRAM-based |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Configuration Interface | — | Serial (passive/active) |