EPF10K130EFC672-2 vs EPF10K250EFC672-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC672-2 sa pamamagitan ng Altera at EPF10K250EFC672-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K130EFC672-2 | EPF10K250EFC672-1 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 6,656 | — |
| Total Gates | ~130,000 | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (RAM bits) | 65,536 | — |
| Maximum User I/Os | 413 | 470 |
| Number of I/O Pins | 672 (package pins) | — |
| Packhaging | 672-ball FineLine BGA | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | — |
| Propagation Delay (typ.) | 0.6 ns | — |
| Internal Operating Frequency (max) | 333.33 MHz | — |
| Temperature na Operasyon | 0 °C to +70 °C (Commercial) | 0C to +70C (Commercial) |
| Speed Grade | -2 | -1 |
| Programming Method | SRAM-based, JTAG (IEEE 1149.1) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Logic Family | — | CMOS |
| Typical System Gates | — | 250,000 |
| Total Pins | — | 672 |
| Package Type | — | BGA-672 |
| Package Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Propagation Delay | — | 0.4 ns |
| Programming Technology | — | In-system, SRAM-based |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |
| Configuration Interface | — | Serial (passive/active) |